Single roll finished product available dimensional value
Total available thickness(μm)
90 ± 5
Roll Width(mm) [customizable]
400
Roll Length(M) [customizable]
100
Main Characteristics
Items
Unit
Typical value
Test method
Adhesion before UV irradiation
g/in
280~380
JIS Z0237
Adhesion after UV irradiation
g/in
< 10
JIS Z0237
UV radiation
mJ/cm2
300
UV energy meter
Tensile Strength(MD)
N/cm
23
JIS K6768
Tensile Strength(TD)
N/cm
19
JIS K6768
Elongation(MD)
%
660
JIS K6732
Elongation(TD)
%
690
JIS K6732
Storage Condition
stored in original cartons at 70°F (21°C) and 50% relative humidity
Period Of Validity
6 months from date of manufacture, avoid exposing to direct sunlight
Description
Wafer UV Dicing UV Release Dicing Tape 140micron Matte Translucent with Acrylic Adhesive for Wafer Back Grinding Tape Semiconductor Polishing belongs to our semiconductor, dicing & release tape range (Specialty Industrial Tapes).
Key details
Adhesive: Acrylic
Color: Transparent
Feature: Easy Peeling No Residue
Application: Wafer Dicing
Type: Wafer UV Dicing Tape
Certification: GS, RoHS, CE, ISO9001
Heat Resistance: Normal Temperature
Waterproof: Waterproof
Available configurations include color, adhesive, base material and liner. Custom widths, lengths, cores, colors and printing can be quoted on request.
Ordering through Xintapes
Minimum order is 30 square meters at US$12.00 – 15.00 per square meter. Send one inquiry with the size, quantity and application, and Xintapes confirms specification, price, lead time and shipping, checks the goods before dispatch and ships them to you.
Frequently asked questions
What is the minimum order quantity (MOQ) for Wafer UV Dicing UV Release Dicing Tape 140micron Matte Translucent with Acrylic Adhesive for Wafer Back Grinding Tape Semiconductor Polishing?
The listed minimum order is 30 square meters, at US$12.00 – 15.00 per square meter. Smaller trial quantities or samples can be requested in your inquiry; Xintapes confirms what is possible for your size.
What are the main specifications of Wafer UV Dicing UV Release Dicing Tape 140micron Matte Translucent with Acrylic Adhesive for Wafer Back Grinding Tape Semiconductor Polishing?
Adhesive: Acrylic; Color: Transparent; Feature: Easy Peeling No Residue; Application: Wafer Dicing; Type: Wafer UV Dicing Tape; Certification: GS, RoHS, CE, ISO9001. The full specification table and any technical parameter tables are listed on this page.
Can the tape be customized?
Listed configurations include color, adhesive, base material and liner. Width, length, thickness, core size, color, logo printing and packing can be quoted to your specification.
What is the lead time and how is it shipped?
Lead time depends on quantity and customization and is confirmed in your quote. Xintapes checks the goods before dispatch and ships by express, air or sea; mixed tape orders can be consolidated in one shipment.
Which other semiconductor, dicing & release tape are available?
Xintapes produces and supplies adhesive tapes for packaging, electrical, construction, electronics and industrial users. Film and backing materials are coated, slit and rewound to the width, length and core you need, checked for thickness and adhesion, then packed for export — so every order, standard or custom, goes through one controlled process.
Custom width, length, thickness and core size
Logo printing, private label and custom packing
Thickness, adhesion and appearance checked before packing
Export cartons and pallets, consolidated mixed orders
Samples available for approval before mass production
Coating & production hallFilm and backing materialsSlitting & rewinding to sizeThickness & adhesion inspectionPacking & warehouse
